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44067-0601 - 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 6 Circuits, Tin (Sn) Plating 3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 6 Circuits, Tin (Sn) Plating

44067-0601_4885277.PDF Datasheet
 Full text search : 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 6 Circuits, Tin (Sn) Plating 3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 6 Circuits, Tin (Sn) Plating

 Related Part Number
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44914-0801 44914-0802 44914-0803 44914-0201 44914- 3.00mm (.118隆卤) Pitch Micro-Fit 3.0, CPI垄芒 Micro-Fit 3.0, BMI垄芒 CPI Vertical Headers
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 Molex Electronics Ltd.
Molex, Inc.
SD-44067-001 44067-1803 0440671803 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header
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44769-0403 SD-44769-001 3.00mm (.118) Pitch Micro-Fit 3.0, BMI Receptacle Header, Dual Row, Vertical, with Press-fit Plastic Pegs
 Molex Electronics Ltd.
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